By Philip Garrou, Christopher Bower, Peter Ramm

The 1st encompassing treatise of this new and extremely vital box places the recognized actual obstacles for traditional second microelectronics
into standpoint with the necessities for extra microelectronics advancements and industry prerequisites. This two-volume handbook
offers 3D options to the characteristic density challenge, addressing all vital matters, akin to wafer processing, die bonding, packaging
know-how, and thermal points. It starts with an introductory half, which defines beneficial ambitions, latest matters and relates 3D integration
to the semiconductor roadmap of the undefined. prior to happening to hide processing expertise and 3D constitution fabrication ideas in
aspect. this can be by means of fields of program and a glance on the way forward for 3D integration.

The editors have assembled contributions from key educational and commercial avid gamers within the box, together with Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and so forth.

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