By Sheng Liu, Yong Liu

Even though there's expanding desire for modeling and simulation within the IC package deal layout part, such a lot meeting tactics and diverse reliability assessments are nonetheless in accordance with the time eating "test and check out out" approach to receive the simplest answer. Modeling and simulation can simply ascertain digital layout of Experiments (DoE) to accomplish the optimum resolution. This has tremendously lowered the associated fee and creation time, specifically for brand spanking new product improvement. utilizing modeling and simulation turns into more and more worthwhile for destiny advances in 3D package deal development.  during this ebook, Liu and Liu let humans within the sector to benefit the fundamental and complicated modeling and simulation talents to aid clear up difficulties they encounter.  

  • Models and simulates a number of tactics in production, reliability and checking out for the 1st time
  • Provides the talents important for digital prototyping and digital reliability qualification and testing
  • Demonstrates concurrent engineering and co-design techniques for complicated engineering layout of microelectronic products
  • Covers packaging and meeting for usual ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
  • Appendix and colour pictures on hand for obtain from the book's significant other website

Liu and Liu have optimized the e-book for training engineers, researchers, and post-graduates in microelectronic packaging and interconnection layout, meeting production, digital reliability/quality, and semiconductor fabrics. Product managers, program engineers, revenues and advertising employees, who have to clarify to buyers how the meeting production, reliability and trying out will impression their items, also will locate this publication a severe resource.

Appendix and colour model of chosen figures are available at www.wiley.com/go/liu/packaging

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